Posted on: Sunday, December 26, 2021 – 8:56 AM | Last update: Sunday, December 26, 2021 – 8:56 AM
The scientific journal “Science Advance” specialized in the field of electronics stated that the new technology relies on the use of plasma extracted from water vapor to fix the gold electrodes on separate surfaces made of polymeric materials without the need for adhesives or high temperatures.
The researchers say that in light of the trend to reduce the sizes of electronics increasingly, as well as the multiple uses of electronic devices that can be worn on the body or that bend to take the shape of the body such as electronic wristbands, the traditional methods of manufacturing these devices have become impractical. Techniques for gluing electronic components together have become one of the biggest problems facing microelectronics manufacturing mechanisms.
The researchers attributed the causes of these problems to the fact that traditional means of conduction, which depend on laying layers of adhesives on delicate surfaces, and then exposing them to heat and pressure to complete the adhesion process, can lead to damage to the delicate components that are used in the electronics industry at the present time.
The team of researchers confirms, in statements reported by the technology-specialized website “TechExplore”, that the new technique relies on the use of a plasma extracted from water vapor to connect two electrodes made of gold on a surface of a polymeric material no more than two thousandths of a millimeter thick and at a temperature The regular room, and they pointed out that the adhesion process requires a waiting period of no more than 12 hours.
“With this new direct bonding technology, we have been able to fabricate a compact system containing flexible organic solar cells and LEDs, and the new technology has achieved better results than traditional adhesives,” says Kenjiro Vikoda, a senior researcher at the Raiken Institute.
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